SILINA is a deeptech startup that has raised several million euros to give birth to the new generation of vision systems, thanks to a disruptive technology that enables to curve imaging sensors (e.g CMOS) at industrial scale.
This major innovation in the semiconductor field aims to become the new standard of the imaging industry. It brings superior image and detection quality to vision systems & cameras in multiple imaging markets, with the added bonus of reducing the weight, volume and cost of these systems.
SILINA offers its clients turnkey sensor curving solutions. Having already attracted major players in aerospace, smartphones, automotive, virtual reality … it now enters its manufacturing phase. SILINA needs you in order to close formal deals with several partners and clients, and drive the spreading of the curved sensors standard across the industry
We are recruiting a Packaging Semiconductor / Back-end Process Technician as a permanent position (CDI) in our facilities in Gardanne (13).
You are responsible for the implementation of manufacturing processes, inspection, and testing of components, especially curved image sensors. You are in strong interaction with the production manager, the technology team and the cleanroom operators. Your technical expertise in the packaging of image sensors (including Datacon pick-and-place and die bonding machines) allows you to produce and propose process improvements. You work in an ISO5-8 clean room environment and will be trained in several state-of-the-art equipment.